Description: The emerging areas of micro- and nanodevices made of metallic materials exhibit important strength differences that result from continuous modification of the material microstructural characteristics with changing size, whereby the smaller is the size the stronger is the response. This resulted in an increasing need for basic research to better understand the underlying deformation mechanisms at the micron and submicron length scales. For example, experimental works have shown increase in strength by decreasing the particle size in particle-reinforced composites, the diameter of thin wires in micro-torsion and uniaxial compression, the thickness of thin films in micro-bending and uniaxial tension, the grain size of polycrystalline materials, void size in porous media, the indentation depth in micro/nano indentation tests etc.

This symposium focuses upon presenting experimental, theoretical, and/or computational results that will increase our understanding of the deformation mechanisms responsible for size effects at the micron and submicron length scales in metallic materials. Presentation topics include but are not limited to the following areas: Size effect in thin films, composites, micro/nano indentation, fracture toughness, fatigue resistance, initial yield strength, and hardening; grain size effect; surface and interface effects; strain-gradient plasticity/damage theories; dislocation mechanics; testing techniques; and measurement of material length scales.