RSS FeedESM Ph.D. Candidate finalist in SES 2008 competition
Category: Student Accomplishments
Posted by: wea100
on Aug 26, 2008
Lei Fang (ESM Ph.D. student) was named a finalist in the Society of Engineering Science 2008 student paper competition.
Fang's abstract, "An electrical technique to measure in-situ contact area during instrumented indentation and its application of characterizing materials that pile-up," was selected as one of the top 16 abstracts out of 160 submitted to the SES 2008 student paper competition.
Lei Fang's research in collaboration with Christopher Muhlstein (MatSE), James Collines (MatSE), Amber Romasco (MatSE) and Lawrence Friedman (ESM) demonstrates how electrical contact resistance can augment instrumented indentation and imaging techniques to characterize the mechanical properties of surfaces
that pile when indented.
For such materials the traditional Oliver-Pharr technique for characterizing surface mechanical properties gives large errors.
Lei Fang will present his paper and compete further at the SES 45th Technical Annual Meeting at the University of Illinois at Urbana-Champaign October 12-15, 2008.
Fang's abstract, "An electrical technique to measure in-situ contact area during instrumented indentation and its application of characterizing materials that pile-up," was selected as one of the top 16 abstracts out of 160 submitted to the SES 2008 student paper competition.
Lei Fang's research in collaboration with Christopher Muhlstein (MatSE), James Collines (MatSE), Amber Romasco (MatSE) and Lawrence Friedman (ESM) demonstrates how electrical contact resistance can augment instrumented indentation and imaging techniques to characterize the mechanical properties of surfaces
that pile when indented.
For such materials the traditional Oliver-Pharr technique for characterizing surface mechanical properties gives large errors.
Lei Fang will present his paper and compete further at the SES 45th Technical Annual Meeting at the University of Illinois at Urbana-Champaign October 12-15, 2008.