An ultrasonic atomic force microscope image made by Bernhard R. Tittmann, Schell Professor of Engineering Science and Mechanics, of uncentered ceramic aluminum oxide (white) held together by a polymer binder (black) was awarded third place in its category in the 5th Annual EDFAS Photo Contest sponsored by the Electronic Device Failure Analysis Society, an Affiliate Society of ASM International.


The top ten entries in each category were displayed at the 31st International Symposium for Testing and Failure Analysis (ISTFA) in San Jose, California, November 6-10, 2005.

A collage of second and third place winners’ entries will be published on a future issue of EDFA magazine.