Graduate student awarded ICOPS travel grant

08/10/2016

UNIVERSITY PARK, Pa. – Zane Cohick, a doctoral candidate in the Department of Engineering Science and Mechanics, was recently awarded a 2016 Student Travel Grant by the Institute of Electrical and Electronics Engineers (IEEE) for the 43rd IEEE International Conference on Plasma Science (ICOPS) held in June in Banff, Alberta, Canada.

Cohick was selected to present his research on Split-Post Dielectric Resonator Plasma Generators which is focused on generating plasmas using dielectric resonators since they offer low energy losses at high frequencies, where metamaterials may operate.

One of the limitations of metamaterials that researchers have been trying to overcome is the narrow bandwidth in which they often function. By replacing the traditional metal components of metamaterials with plasmas, it may be possible to rapidly tune metamaterials to work at many frequencies from GHz to THz range. This tunability arises because plasma properties can be controlled via parameters such as input power and pressure.

Cohick’s research poster explains the goals of his research, which include reducing energy loss, remotely igniting plasmas, and reducing power.

The ICOPS 2016 Student Travel Grants are made possible by the support of the U.S. Department of Energy Office of Science, the U.S. National Science Foundation, SLAC National Accelerator Laboratory's High Energy Density Division, and the University of Alberta's Faculty of Engineering and Plasma Quebec.

 

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MEDIA CONTACT:

Chris Spallino

cjs53@psu.edu

 
 

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The Penn State Department of Engineering Science and Mechanics (ESM) is an internationally distinguished department that is recognized for its globally competitive excellence in engineering and scientific accomplishments, research, and educational leadership.

Our Engineering Science program is the official undergraduate honors program of the College of Engineering, attracting the University’s brightest engineering students. We also offer graduate degrees in ESM, engineering mechanics, engineering at the nano-scale, and an integrated undergraduate/graduate program.

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